PREPARATION AND SUPERCONDUCTING PROPERTIES OF BI-PB-SR-CA-CU-O FILMS (TC=106-K) BY THE DIPPING-PYROLYSIS PROCESS

被引:15
|
作者
MANABE, T
TSUNODA, T
KONDO, W
SHINDO, Y
MIZUTA, S
KUMAGAI, T
机构
[1] National Chemical Laboratory for Industry, Tsukuba, Ibaraki
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1992年 / 31卷 / 04期
关键词
BI-PB-SR-CA-CU-O; HIGH-TC SUPERCONDUCTOR FILM; CRITICAL CURRENT DENSITY; DIPPING-PYROLYSIS PROCESS; METAL NAPHTHENATES;
D O I
10.1143/JJAP.31.1020
中图分类号
O59 [应用物理学];
学科分类号
摘要
Superconducting Bi-Pb-Sr-Ca-Cu-O (2223 as the major phase) films were prepared by the dipping-pyrolysis process on MgO(100) substrates using a metal naphthenate solution. From the XRD and SEM-EDX analyses, the formation of the 2223 phase with well-developed platelike grains was facilitated in the films by placing a Pb-containing BSCCO pellet on the surface of the prefired films during the heat treatment (850-degrees-C in air) and by the use of a nominal composition of Bi:Pb:Sr:Ca:Cu = 1.8:0.4:2.0:2.4:3.6 in molar ratio, i.e., a Ca-and-Cu-rich composition compared to the 2223 phase. The values of T(c, zero) and J(c)(77 K) were 106 K and 2 x 10(3) A/cm2 , respectively. The dependence of critical current densities on temperature showed that J(c) was approximately proportional to (1 - T/T(c))3/2, which corresponds to the results of the proximity junction tunneling (SNIS) model.
引用
收藏
页码:1020 / 1025
页数:6
相关论文
共 50 条
  • [31] THE SUPERCONDUCTING PROPERTIES OF [001] TWIST BOUNDARIES IN A BI-SR-CA-CU-O SUPERCONDUCTOR
    TOMITA, N
    TAKAHASHI, Y
    MORI, M
    ISHIDA, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1992, 31 (7B): : L942 - L945
  • [32] PREPARATION OF AG-SHEATHED (TL,BI)-CA-SR-CU-O SUPERCONDUCTING WIRE
    TORII, Y
    KUGAI, H
    TAKEI, H
    TADA, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1990, 29 (06): : L952 - L954
  • [33] DENSIFICATION OF BI-PB-SR-CA-CU-O BULK SUPERCONDUCTOR BY HOT PRESS SINTERING AND CRITICAL CURRENT-DENSITY
    MURAYAMA, N
    KODAMA, Y
    SAKAGUCHI, S
    WAKAI, F
    NIPPON SERAMIKKUSU KYOKAI GAKUJUTSU RONBUNSHI-JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, 1992, 100 (03): : 223 - 226
  • [34] Transmission electron microscopic studies of YbBa2Cu3O7-δ superconducting final films formed on LaAlO3(001) substrates by the dipping-pyrolysis process
    Shibata, J
    Yamagiwa, K
    Hirabayashi, I
    Hirayama, T
    Ikuhara, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2000, 39 (6A): : 3361 - 3365
  • [35] FABRICATION AND CHARACTERIZATION OF BI(PB)-SR-CA-CU-O/AG2O SUPERCONDUCTING TUBES
    KAO, CH
    LIN, LT
    CHIU, YD
    WANG, MJ
    LIN, CL
    WU, MK
    JOURNAL OF ELECTRONIC MATERIALS, 1995, 24 (12) : 1893 - 1896
  • [36] CRITICAL CURRENT-DENSITY AND FLUX CREEP IN MELT-PROCESSED BI-PB-SR-CA-CU-O SUPERCONDUCTORS
    UMEMURA, T
    NOZAKI, A
    EGAWA, K
    UCHIKAWA, F
    SATO, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (9A): : 2698 - 2703
  • [37] Atomic force microscopy study of epitaxial Bi4Ti3O12 thin films formed using a dipping-pyrolysis process
    Ryu, HW
    Hwang, KS
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2002, 40 (03) : 493 - 496
  • [38] CRITICAL-CURRENT DENSITIES AT 77-K IN BA2YCU3O7-Y-AG FILMS PREPARED BY DIPPING-PYROLYSIS PROCESS
    KUMAGAI, T
    YAMASAKI, H
    ENDO, K
    MANABE, T
    NIINO, H
    TSUNODA, T
    KONDO, W
    MIZUTA, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1993, 32 (11A): : L1602 - L1605
  • [39] Epitaxial growth of Bi4Ti3O12 thin films on LaAlO3(012) and MgO(100) by dipping-pyrolysis process
    Hwang, KS
    Kim, BH
    Manabe, T
    Yamaguchi, I
    Kumagai, T
    Mizuta, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1999, 38 (1A): : 219 - 220
  • [40] THE PHASE-TRANSFORMATION OF BI-PB-SR-CA-CU-O BULK MATERIALS ARE RAPIDLY MELTED AND SOLIDIFIED BY A CO2-LASER
    KAO, CH
    CHERN, HL
    WANG, CJ
    JOURNAL OF ELECTRONIC MATERIALS, 1995, 24 (12) : 1825 - 1828