EXPANDED CONTACTS AND INTERCONNEXIONS TO MONOLITHIC SILICON INTEGRATED CIRCUITS

被引:50
作者
CUNNINGHAM, JA
机构
关键词
D O I
10.1016/0038-1101(65)90061-4
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:735 / +
页数:1
相关论文
共 29 条
[1]   TECHNIQUE FOR CONNECTING ELECTRICAL LEADS TO SEMICONDUCTORS [J].
ANDERSON, OL ;
CHRISTENSEN, H ;
ANDREATCH, P .
JOURNAL OF APPLIED PHYSICS, 1957, 28 (08) :923-923
[2]   SIMPLE, RAPID SPUTTERING APPARATUS [J].
BELSER, RB ;
HICKLIN, WH .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1956, 27 (05) :293-296
[4]  
BELSER RB, 7 US SIGN CORPS ENG
[5]  
BELSER RB, DA36039SC42453
[6]  
BELSER RB, 163176 US SIGN CORPS
[7]   ADHESION OF EVAPORATED METAL FILMS ON GLASS [J].
BENJAMIN, P ;
WEAVER, C .
PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1961, 261 (1304) :516-+
[8]   MEASUREMENT OF ADHESION OF THIN FILMS [J].
BENJAMIN, P ;
WEAVER, C .
PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1960, 254 (1277) :163-176
[9]  
BERNSTEIN L, 1961, SEMICONDUCTOR PROD, P34
[10]  
Coffinberry AS, 1938, T AM I MIN MET ENG, V128, P249