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- [32] HIGH-SPEED, SELECTIVE GOLD-PLATING OF LEAD FRAMES FOR MICRO-ELECTRONIC PACKAGING .1. PROCESS-DEVELOPMENT AND EVALUATION OF PROCESS PARAMETERS WESTERN ELECTRIC ENGINEER, 1978, 22 (02): : 48 - 56
- [33] Highly Reliable 28nm Embedded Flash Process Development for High-Density and High-Speed Automotive Grade-1 Application 2021 IEEE INTERNATIONAL MEMORY WORKSHOP (IMW), 2021, : 88 - 90