共 9 条
[4]
GOOSSEN KW, 1994 P IEEE SARN S
[7]
THE IMPORTANCE OF MATERIAL SELECTION FOR FLIP-CHIP ON BOARD ASSEMBLIES
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1994, 17 (03)
:248-255
[8]
PATHAK RN, 1993, IEEE PHOTONIC TECH L, V5, P1392