ELECTROCHEMICAL EVALUATION OF COPPER DEPOSITION WITH GAS SPARGING

被引：15

作者：

UCEDA, DA ^{[1
]}

OKEEFE, TJ ^{[1
]}

机构：

[1] UNIV MISSOURI,CTR MAT RES,ROLLA,MO 65401

来源：

JOURNAL OF APPLIED ELECTROCHEMISTRY | 1990年 / 20卷 / 02期

关键词：

D O I：

10.1007/BF01033612

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The influence of gas sparging during copper electrolysis was studied using standard electrochemical techniques. The polarization behaviour of acid copper electrolytes was determined in the presence and absence of gas sparging on vertical electrodes. Tracer ion techniques were employed to determine the effect of gas sparging and forced circulation of the electrolyte on the mass transfer characteristics of the system. In addition to the potentiodynamic scans, 3-h copper deposits were produced for morphology and orientation studies. The effect of current density and temperature on deposition were also studied. The polarization experiments have shown that a mass transfer component becomes evident at about 40% of the limiting current density at which point the deposit becomes noticeably rougher. © 1990 Chapman and Hall Ltd.

引用

页码：327 / 334

页数：8

共 17 条

[1]

BURROWS IR, 1975, J ELECTROANAL CHEM, V58, P241, DOI 10.1016/S0022-0728(75)80356-1

[2] THE NATURE OF COPPER ELECTROWON IN THE PRESENCE OF IRON USING SULFUR-DIOXIDE SPARGING [J].