INVESTIGATION ON ENHANCEMENT OF COPPER BALL BONDS DURING THERMAL CYCLE TESTING

被引：5

作者：

ONUKI, J

KOIZUMI, M

SUZUKI, H

ARAKI, I

机构：

[1] HITACHI LTD,TAKASAKI WORKS,CTR PACKAGE ENGN,TAKASAKI,GUNMA 37011,JAPAN

[2] HITACHI LTD,HITACHI RES LAB,THIN FILM RES CTR,HITACHI,IBARAKI 31912,JAPAN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1991年 / 14卷 / 02期

关键词：

D O I：

10.1109/33.87320

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Copper ball bonds failures of resin molded IC's during thermal cycle test are found to be caused by crack propagation along coarse grain boundaries in the root of balls. Grain size less than 10-mu-m in the root of balls are essential to enhance the reliability of ball bonds. The appropriate grain size is obtained if the optimum bonding condition is employed; for example, current density: 4 MA/cm, discharge time: 50-mu-s.

引用

页码：392 / 395

页数：4

共 7 条

[1]

HIROTA J, 1985 P EL COMP C, P116

[2] HIGH-SPEED THERMOCOMPRESSION BONDING OF AU WIRES TO AL ELECTRODES ON SEMICONDUCTOR-DEVICES [J].