DIFFUSION OF COPPER IN THIN TIN FILMS

[1] BARRETT CR, 1973, PRINCIPLES ENG MATER, P154

[2] INVESTIGATION OF CONTACT METALLIZATION SYSTEMS FOR SOLAR-CELLS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (12) : 2702 - 2704

[3] THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS [J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) : 4297 - 4299

[4] CHEUNG NW, 1980, P S THIN FILM INTERF, V80, P323

[5] CHU WK, 1978, BACKSCATTERING SPECT, P354

[6] Crank J., 1975, MATH DIFFUSION, P50

[7] THIN-FILM INTERDIFFUSION .2. TI-RH, TI-PT, TI-RH-AU, AND TI-AU-RH [J]. JOURNAL OF APPLIED PHYSICS, 1975, 46 (10) : 4284 - 4290

[8] TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM [J]. THIN SOLID FILMS, 1979, 60 (02) : 237 - 247

[9] APPLICATION OF TI-W BARRIER METALLIZATION FOR INTEGRATED-CIRCUITS [J]. THIN SOLID FILMS, 1978, 53 (02) : 117 - 128

[10] FORMALISM FOR EXTRACTING DIFFUSION-COEFFICIENTS FROM CONCENTRATION PROFILES [J]. SURFACE SCIENCE, 1976, 54 (01) : 79 - 90

[1] BARRETT CR, 1973, PRINCIPLES ENG MATER, P154

[2] INVESTIGATION OF CONTACT METALLIZATION SYSTEMS FOR SOLAR-CELLS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (12) : 2702 - 2704

[3] THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS [J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) : 4297 - 4299

[4] CHEUNG NW, 1980, P S THIN FILM INTERF, V80, P323

[5] CHU WK, 1978, BACKSCATTERING SPECT, P354

[6] Crank J., 1975, MATH DIFFUSION, P50

[7] THIN-FILM INTERDIFFUSION .2. TI-RH, TI-PT, TI-RH-AU, AND TI-AU-RH [J]. JOURNAL OF APPLIED PHYSICS, 1975, 46 (10) : 4284 - 4290

[8] TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM [J]. THIN SOLID FILMS, 1979, 60 (02) : 237 - 247

[9] APPLICATION OF TI-W BARRIER METALLIZATION FOR INTEGRATED-CIRCUITS [J]. THIN SOLID FILMS, 1978, 53 (02) : 117 - 128

[10] FORMALISM FOR EXTRACTING DIFFUSION-COEFFICIENTS FROM CONCENTRATION PROFILES [J]. SURFACE SCIENCE, 1976, 54 (01) : 79 - 90