LEAKAGE AND INTERFACE ENGINEERING IN TITANATE THIN-FILMS FOR NONVOLATILE FERROELECTRIC MEMORY AND ULSI DRAMS

被引:34
作者
CHEN, X [1 ]
KINGON, AI [1 ]
ALSHAREEF, HN [1 ]
BELLUR, KR [1 ]
GIFFORD, K [1 ]
AUCIELLO, O [1 ]
机构
[1] MCNC,DIV ELECTR TECHNOL,RES TRIANGLE PK,NC 27709
关键词
D O I
10.1080/10584589508220240
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The leakage behavior of Pb(Zr,Ti)O-3 PZT and (Ba,Sr)TiO3 (BST) thin films has been studied. The leakage behavior is dependent upon the bottom electrode. PZT films on RuO2 bottom electrodes display a large leakage, predominantly ohmic in behavior, which we have shown to be PZT microstructure-controlled. The leakage of PZT and BST films on Pt display Schottky emission characteristics which is controlled by the film/electrode interface. In the case of PZT films, we have shown that several methods can be utilized to successfully lower the RuO2/PZT/RuO2 system leakage, while retaining the long term performance. These methods include pre-annealing of RuO2 bottom electrode prior to PZT film deposition; addition of buffer layer between RuO2 and PZT film; and PZT film growth via in-situ ion beam sputter-deposition.
引用
收藏
页码:291 / 306
页数:16
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