TERNARY ALLOY-FILMS OF NI-CR-AL FOR THIN-FILM RESISTORS

[1] BICKNELL RW, 1964, MICROELECTRON RELIAB, V3, P61

[2] GLEITER H, 1967, Z METALLKD, V58, P157

[3] ELECTRICAL AND STRUCTURAL-PROPERTIES OF NICR THIN-FILM RESISTORS REACTIVELY SPUTTERED IN O2 [J]. THIN SOLID FILMS, 1974, 20 (02) : 345 - 362

[4] HORNBOGEN E, 1964, Z METALLKD, V55, P293

[5] STRUCTURAL AND ELECTRICAL PROPERTIES OF EVAPORATED CR-NI FILMS AS A FUNCTION OF GAS PRESSURE [J]. THIN SOLID FILMS, 1973, 17 (01) : 105 - 111

[6] STRUCTURAL AND ELECTRICAL PROPERTIES OF SPUTTERED CRNI FILMS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 446 - &

[7] PROPERTIES OF EVAPORATED NI-CR FILMS WITH AN ALUMINUM CONTENT OF ABOUT 50-PERCENT [J]. THIN SOLID FILMS, 1985, 123 (01) : 57 - 62

[8] STRUCTURE OF VACUUM-DEPOSITED THICK-FILMS OF NI-CR-AL [J]. THIN SOLID FILMS, 1984, 120 (01) : 69 - 73

[9] Schippel E., 1976, Kristall und Technik, V11, P753, DOI 10.1002/crat.19760110708

[10] Schippel E., 1976, Kristall und Technik, V11, P183, DOI 10.1002/crat.19760110209

[1] BICKNELL RW, 1964, MICROELECTRON RELIAB, V3, P61

[2] GLEITER H, 1967, Z METALLKD, V58, P157

[3] ELECTRICAL AND STRUCTURAL-PROPERTIES OF NICR THIN-FILM RESISTORS REACTIVELY SPUTTERED IN O2 [J]. THIN SOLID FILMS, 1974, 20 (02) : 345 - 362

[4] HORNBOGEN E, 1964, Z METALLKD, V55, P293

[5] STRUCTURAL AND ELECTRICAL PROPERTIES OF EVAPORATED CR-NI FILMS AS A FUNCTION OF GAS PRESSURE [J]. THIN SOLID FILMS, 1973, 17 (01) : 105 - 111

[6] STRUCTURAL AND ELECTRICAL PROPERTIES OF SPUTTERED CRNI FILMS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01): : 446 - &

[7] PROPERTIES OF EVAPORATED NI-CR FILMS WITH AN ALUMINUM CONTENT OF ABOUT 50-PERCENT [J]. THIN SOLID FILMS, 1985, 123 (01) : 57 - 62

[8] STRUCTURE OF VACUUM-DEPOSITED THICK-FILMS OF NI-CR-AL [J]. THIN SOLID FILMS, 1984, 120 (01) : 69 - 73

[9] Schippel E., 1976, Kristall und Technik, V11, P753, DOI 10.1002/crat.19760110708

[10] Schippel E., 1976, Kristall und Technik, V11, P183, DOI 10.1002/crat.19760110209