RELATIONSHIP BETWEEN MICROSTRUCTURE, HARDNESS AND ELECTRICAL-CONDUCTIVITY OF 2219 ALUMINUM

被引：22

作者：

NATAN, M ^{[1
]}

CHIHOSKI, RA ^{[1
]}

机构：

[1] MARTIN MARIETTA CORP,DENVER,CO 80201

来源：

JOURNAL OF MATERIALS SCIENCE | 1983年 / 18卷 / 11期

关键词：

D O I：

10.1007/BF00544153

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：3288 / 3298

页数：11

共 13 条

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[8] HIGH-RESOLUTION ELECTRON-MICROSCOPE OBSERVATIONS ON PRECIPITATION IN AL-3.0PERCENT CU ALLOY [J].

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[9] AN INVESTIGATION OF THE PRECIPITATION-HARDENING PROCESS IN ALUMINUM-ALLOY 2219 BY MEANS OF SOUND-WAVE VELOCITY AND ULTRASONIC-ATTENUATION [J].

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[10]

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