LASER SOLDERING OF SURFACE-MOUNTED DEVICES FOR HIGH-RELIABILITY APPLICATIONS

被引：22

作者：

SEMERAD, E ^{[1
]}

MUSIEJOVSKY, L ^{[1
]}

NICOLICS, J ^{[1
]}

机构：

[1] VIENNA TECH UNIV,INST MAT ELECT ENGN,A-1040 VIENNA,AUSTRIA

来源：

JOURNAL OF MATERIALS SCIENCE | 1993年 / 28卷 / 18期

关键词：

D O I：

10.1007/BF00361180

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Laser soldering processes are characterized by the temperature during soldering within the joint as a function of time and as a function of the soldering parameters. These parameters are optimized by a metallurgical assessment of the quality of the joints. The thermal-fatigue properties of soldered joints important for space applications were investigated for different solder alloys by the thermal-cycling test according to ESA PSS-01-704. In addition, measurements of the shear strength were carried out for a small number of specimens in order to check if the mechanical strength of joints is altered by thermal cycling.

引用

页码：5065 / 5069

页数：5