共 12 条
- [11] 1979, METALS HDB, V5
- [12] 1982, REPORT INT TIN RES C, P14
THE STRENGTH OF BRASS/SN-PB-SB SOLDER JOINTS CONTAINING 0 TO 10-PERCENT-SB
被引：24
作者：
TOMLINSON, WJ
BRYAN, NJ
机构：
[1] Coventry Polytechnic, Dep of, Materials, Coventry, Engl, Coventry Polytechnic, Dep of Materials, Coventry, Engl
关键词：
METALLOGRAPHY - Diffusion - SOLDERS - Testing - TIN LEAD ANTIMONY ALLOYS - Applications;
D O I：
10.1007/BF01144706
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The strength of brass/Sn-Pb-Sb solder joints has been determined for solders containing 0 to 10%Sb and the fracture process examined by microscopial techniques. Intermetallic formation by interdiffusion in the Cu-Zn/Sn-Sb and Cu-Zn/Pb-Sb systems were also investigated. Additions of up to 10%Sb in the solder reduce the shear strength by only 10%, but cause the joint to have a variable and occasionally very low fatigue resistance.
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页码：103 / 109
页数：7
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