THE STRENGTH OF BRASS/SN-PB-SB SOLDER JOINTS CONTAINING 0 TO 10-PERCENT-SB

被引：24
作者：
TOMLINSON, WJ
BRYAN, NJ
机构：
[1] Coventry Polytechnic, Dep of, Materials, Coventry, Engl, Coventry Polytechnic, Dep of Materials, Coventry, Engl
来源：
JOURNAL OF MATERIALS SCIENCE | 1986年 / 21卷 / 01期
关键词：
METALLOGRAPHY - Diffusion - SOLDERS - Testing - TIN LEAD ANTIMONY ALLOYS - Applications;
D O I：
10.1007/BF01144706
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The strength of brass/Sn-Pb-Sb solder joints has been determined for solders containing 0 to 10%Sb and the fracture process examined by microscopial techniques. Intermetallic formation by interdiffusion in the Cu-Zn/Sn-Sb and Cu-Zn/Pb-Sb systems were also investigated. Additions of up to 10%Sb in the solder reduce the shear strength by only 10%, but cause the joint to have a variable and occasionally very low fatigue resistance.
引用
收藏
页码：103 / 109
页数：7
相关论文
共 12 条
  • [1] ACKROYD M, 1975, METALS TECH FEB, P73
  • [2] Baker WA, 1939, J I MET, V65, P277
  • [3] BARRY BTK, 1984, TIN ITS ALLOYS COMPO, P88
  • [4] HAGSTROM RA, 1969, OCT P INT NAT EL PAC, P271
  • [5] THE SURFACE-TENSION OF TIN LEAD ALLOYS IN CONTACT WITH FLUXES
    HOWIE, FH
    HONDROS, ED
    [J]. JOURNAL OF MATERIALS SCIENCE, 1982, 17 (05) : 1434 - 1440
  • [6] MANKO HH, 1979, SOLDERS SOLDERING, P101
  • [7] NIGHTINGALE SJ, 1942, RES MONOGRAPH BRIT N, V1
  • [8] STONE KR, 1983, BRAZING SOLDERING, P20
  • [9] Tasaki M., 1929, MEM COLL ENG KYOTO A, V12, P227
  • [10] THWAITES CJ, 1984, BRAZING SOLDERING, P32
12