INTERDIFFUSION IN COMPOSITION-MODULATED COPPER-GOLD THIN-FILMS

被引：46
作者：
PAULSON, WM
HILLIARD, JE
机构：
[1] MOTOROLA INC, PHOENIX, AZ 85008 USA
[2] NORTHWESTERN UNIV, EVANSTON, IL 60201 USA
来源：
JOURNAL OF APPLIED PHYSICS | 1977年 / 48卷 / 06期
关键词：
D O I：
10.1063/1.324027
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页码：2117 / 2123
页数：7
相关论文
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