ELECTRODEPOSITION KINETICS FOR TIN, LEAD, AND TIN-LEAD FLUOBORATE PLATING SOLUTIONS

被引:13
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作者
TAM, TM
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D O I
10.1149/1.2109020
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:1792 / 1796
页数:5
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