ELECTRODEPOSITION KINETICS FOR TIN, LEAD, AND TIN-LEAD FLUOBORATE PLATING SOLUTIONS

被引：13

作者：

TAM, TM

机构：

来源：

关键词：

D O I：

10.1149/1.2109020

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1792 / 1796

页数：5

共 50 条

[21] Tin-lead plating on encapsulated semiconductor lead frames
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