ELECTROMIGRATION FAILURE IN AU THIN-FILM CONDUCTORS

被引：0

|

作者：

AGARWALA, BN ^{[1
]}

机构：

[1] IBM CORP,POUGHKEEPSIE,NY 12602

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1975年

关键词：

D O I：

10.1109/IRPS.1975.362683

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：107 / 112

页数：6

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