ROOM-TEMPERATURE TENSILE PROPERTIES OF SN-5-PERCENT-SB SOLDER

被引：17

作者：

MAHIDHARA, RK

SASTRY, SML

JERINA, KL

TURLIK, I

MURTY, KL

机构：

[1] WASHINGTON UNIV,MAT RES LAB,ST LOUIS,MO 63130

[2] MICROELECTR CTR N CAROLINA,RES TRIANGLE PK,NC 27709

[3] N CAROLINA STATE UNIV,RALEIGH,NC 27695

来源：

关键词：

D O I：

10.1007/BF00405039

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：1387 / 1389

页数：3

共 14 条

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[3]

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[4]

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[5]

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[6]

HWANG J, 1991, ELECTRONICS PACKAGIN

[7]

HWANG JS, 1989, SOLDER PASTE ELECTRO

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JIN, SH .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1993, 45 (07) :13-13

[9]

LEDERICH RJ, 1986, ASTM STP, V890

[10]

LEWIS WR, 1959, NOTES SOLDERING