OXIDE FORMATION DURING PLASMA-ETCHING OF SILICON-CONTAINING RESISTS

被引:26
作者
HARTNEY, MA [1 ]
CHIANG, JN [1 ]
HESS, DW [1 ]
SOANE, DS [1 ]
机构
[1] UNIV CALIF BERKELEY,DEPT CHEM ENGN,BERKELEY,CA 94720
关键词
D O I
10.1063/1.101337
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:1510 / 1512
页数:3
相关论文
共 18 条
[1]  
CHIANG JN, 1989, J APPL PHYS, V65
[2]   MECHANISM OF OXYGEN PLASMA-ETCHING OF POLYDIMETHYL SILOXANE FILMS [J].
CHOU, NJ ;
TANG, CH ;
PARASZCZAK, J ;
BABICH, E .
APPLIED PHYSICS LETTERS, 1985, 46 (01) :31-33
[4]  
COOPMANS F, 1986, P SOC PHOTO-OPT INS, V633, P126
[5]  
GOZDZ AS, 1987, ACS SYM SER, V346, P334
[6]  
HARTNEY MA, IN PRESS ADV RESIST, V6
[7]   PROPERTIES OF OXIDIZED SILICON AS DETERMINED BY ANGULAR-DEPENDENT X-RAY PHOTOELECTRON-SPECTROSCOPY [J].
HILL, JM ;
ROYCE, DG ;
FADLEY, CS ;
WAGNER, LF ;
GRUNTHANER, FJ .
CHEMICAL PHYSICS LETTERS, 1976, 44 (02) :225-231
[8]   SPUTTERING STUDIES OF INSULATORS BY MEANS OF LANGMUIR PROBES [J].
JORGENSO.GV ;
WEHNER, GK .
JOURNAL OF APPLIED PHYSICS, 1965, 36 (09) :2672-&
[10]   EXPERIMENTAL TESTS OF THE STEADY-STATE MODEL FOR OXYGEN REACTIVE ION ETCHING OF SILICON-CONTAINING POLYMERS [J].
JURGENSEN, CW ;
SHUGARD, A ;
DUDASH, N ;
REICHMANIS, E ;
VASILE, MJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (05) :2938-2944