SOLID-II - HIGH-VOLTAGE HIGH-GAIN KILO-ANGSTROM-CHANNEL-LENGTH CMOSFETS USING SILICIDE WITH SELF-ALIGNED ULTRASHALLOW (3S) JUNCTION

被引:19
作者
HORIUCHI, M
YAMAGUCHI, K
机构
关键词
D O I
10.1109/T-ED.1986.22476
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:260 / 269
页数:10
相关论文
共 30 条
[1]   GENERALIZED SCALING THEORY AND ITS APPLICATION TO A 1/4 MICROMETER MOSFET DESIGN [J].
BACCARANI, G ;
WORDEMAN, MR ;
DENNARD, RH .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1984, 31 (04) :452-462
[2]   CONTACT RESISTANCE AND CONTACT RESISTIVITY [J].
BERGER, HH .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (04) :507-&
[3]   MODELS FOR CONTACTS TO PLANAR DEVICES [J].
BERGER, HH .
SOLID-STATE ELECTRONICS, 1972, 15 (02) :145-&
[4]   TITANIUM SILICIDE FORMATION - EFFECT OF OXYGEN DISTRIBUTION IN THE METAL-FILM [J].
BERTI, M ;
DRIGO, AV ;
COHEN, C ;
SIEJKA, J ;
BENTINI, GG ;
NIPOTI, R ;
GUERRI, S .
JOURNAL OF APPLIED PHYSICS, 1984, 55 (10) :3558-3565
[5]   THERMODYNAMIC CONSIDERATIONS IN REFRACTORY METAL-SILICON-OXYGEN SYSTEMS [J].
BEYERS, R .
JOURNAL OF APPLIED PHYSICS, 1984, 56 (01) :147-152
[6]   CO2SI, CRSI2, ZRSI2 AND TISI2 FORMATION STUDIED BY A RADIOACTIVE SI-31 MARKER TECHNIQUE [J].
BOTHA, AP ;
PRETORIUS, R .
THIN SOLID FILMS, 1982, 93 (1-2) :127-133
[7]   GROWTH KINETICS OBSERVED IN FORMATION OF METAL SILICIDES ON SILICON [J].
BOWER, RW ;
MAYER, JW .
APPLIED PHYSICS LETTERS, 1972, 20 (09) :359-&
[8]  
Brice D.K., 1975, ION IMPLANTATION RAN
[9]   CONTACT RESISTANCE IN DIFFUSED RESISTORS [J].
CHANG, IF .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1970, 117 (03) :368-&
[10]  
Chatterjee P. K., 1980, IEEE Electron Device Letters, VEDL-1, P220, DOI 10.1109/EDL.1980.25295