THICK-FILM HYBRID MICROELECTRONICS - ASPECTS OF SOLDERABILITY

被引：0

作者：

WIEDERMANN, W

FASCHING, GM

机构：

来源：

ZEITSCHRIFT FUR WERKSTOFFTECHNIK-MATERIALS TECHNOLOGY AND TESTING | 1987年 / 18卷 / 02期

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中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：49 / 54

页数：6

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