THICK-FILM HYBRID MICROELECTRONICS - ASPECTS OF SOLDERABILITY

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作者：

WIEDERMANN, W

FASCHING, GM

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ZEITSCHRIFT FUR WERKSTOFFTECHNIK-MATERIALS TECHNOLOGY AND TESTING | 1987年 / 18卷 / 02期

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T [工业技术];

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08 ;

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页码：49 / 54

页数：6

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