CURING BEHAVIOR AND BONDING PROPERTIES OF THERMOSETTING RESIN ADHESIVES .4. CURING BEHAVIOR OF PHENOL-MELAMINE-FORMALDEHYDE RESIN UNDER VARIOUS HOT-PRESSING CONDITIONS

被引：0
|
作者：
ROH, JK
HIGUCHI, M
SAKATA, I
机构：
来源：
MOKUZAI GAKKAISHI | 1990年 / 36卷 / 01期
关键词：
D O I：
暂无
中图分类号：
TB3 [工程材料学]; TS [轻工业、手工业、生活服务业];
学科分类号：
0805 ; 080502 ; 0822 ;
摘要：
引用
收藏
页码：36 / 41
页数：6
相关论文
共 48 条
  • [21] Curing Behavior of Wood Adhesives under High-Pressure Steam III. Bonding strength of phenolic resin
    Umemura, K.
    Tanaka, H.
    Mizuno, Y.
    Kawai, S.
    Mokuzai Gakkaishi/Journal of the Japan Wood Research Society, 42 (10):
  • [22] Curing behavior of wood adhesives under high-pressure steam .3. Bonding strength of phenolic resin
    Umemura, K
    Tanaka, H
    Mizuno, Y
    Kawai, S
    MOKUZAI GAKKAISHI, 1996, 42 (10): : 985 - 991
  • [23] Thermal curing behavior of modified urea-formaldehyde resin adhesives with two formaldehyde scavengers and their influence on adhesion performance
    Park, Byung-Dae
    Kang, Eun-Chang
    Park, Jong-Young
    JOURNAL OF APPLIED POLYMER SCIENCE, 2008, 110 (03) : 1573 - 1580
  • [24] Effect of bio-scavengers on the curing behavior and bonding properties of melamine-formaldehyde resins
    Kim, Sumin
    Kim, Hyun-Joong
    Kim, Hee-Soo
    Lee, Hwa Hyoung
    MACROMOLECULAR MATERIALS AND ENGINEERING, 2006, 291 (09) : 1027 - 1034
  • [25] Thermal curing behavior of modified urea-formaldehyde resin adhesives with two formaldehyde scavengers and their influence on adhesion performance
    Park, Byung-Dae
    Kang, Eun-Chang
    Park, Jong-Young
    Journal of Applied Polymer Science, 2008, 110 (03): : 1573 - 1580
  • [26] Curing and thermal properties of co-polymerized tannin phenol-formaldehyde resin for bonding wood veneers
    Hafiz, Nur Liyana Mohamad
    Tahir, Paridah Md
    Hua, Lee Seng
    Abidin, Zurina Zainal
    Sabaruddin, Fatimah Athiyah
    Yunus, Noryuziah Mohd
    Abdullah, Ummi Hani
    Khalil, Abdul H. P. S.
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2020, 9 (04): : 6994 - 7001
  • [27] PHENOL-FORMALDEHYDE RESIN CURING AND BONDING IN STEAM-INJECTION PRESSING .2. DIFFERENCES BETWEEN RATES OF CHEMICAL AND MECHANICAL RESPONSES TO RESIN CURE
    CHRISTIANSEN, AW
    FOLLENSBEE, RA
    GEIMER, RL
    KOUTSKY, JA
    MYERS, GE
    HOLZFORSCHUNG, 1993, 47 (01) : 76 - 82
  • [28] Curing behavior and adhesion properties of epoxy resin blended with phenol-liquefied Cryptomeria japonica
    Wen-Jau Lee
    Chen-Ling Kang
    Yi-Chun Chen
    Zheng-Ying Wu
    European Journal of Wood and Wood Products, 2018, 76 : 1563 - 1570
  • [29] Thermal curing behavior of phenol formaldehyde resin-impregnated paper evaluated using DSC and dielectric analysis
    Nitin Gupta
    Arunjunai Raj Mahendran
    Stephanie Weiss
    Mohammed Khalifa
    Journal of Thermal Analysis and Calorimetry, 2024, 149 : 2609 - 2618
  • [30] Curing behavior and adhesion properties of epoxy resin blended with phenol-liquefied Cryptomeria japonica
    Lee, Wen-Jau
    Kang, Chen-Ling
    Chen, Yi-Chun
    Wu, Zheng-Ying
    EUROPEAN JOURNAL OF WOOD AND WOOD PRODUCTS, 2018, 76 (05) : 1563 - 1570
12345