RESISTANCE TO MICRO-PLASTIC DEFORMATION IN SUPERCONDUCTING Y-BA-CU-O

被引:9
作者
NISHI, Y
TOKUNAGA, S
TOYAMA, T
机构
[1] Tokai Univ Hiratsuka, Jpn, Tokai Univ Hiratsuka, Jpn
关键词
CERAMIC MATERIALS - Deformation - POLISHING - STRAIN - STRESSES - YTTRIUM COMPOUNDS;
D O I
10.1007/BF01729903
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A study was undertaken to obtain information about the relationship between stress and strain under micro-plastic deformation of Y-Ba-Cu-O which shows high T//c above 90 K. Polishing increases T//c because the surface layer of sintered Y-Ba-Cu oxide decreases T//c. The authors determined the thickness of the surface layer. The resistance to micro-plastic deformation H//v is 520 on the surface and 300 in the bulk. Thus, the oxide is soft. The relationship between load, P, and hole diameter, d, is expressed by an equation in the bulk. From this, a linear stress-strain curve for microdeformation can be deduced.
引用
收藏
页码:20 / 22
页数:3
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