CHARACTERIZATION OF PARTICLE MORPHOLOGY AND RHEOLOGICAL BEHAVIOR IN SOLDER PASTE

被引：24

作者：

EVANS, JW

BEDDOW, JK

机构：

[1] UNIV IOWA,DEPT CHEM & MAT ENGN,IOWA CITY,IA 52242

[2] UNIV IOWA,FINE PARTICLE RES GRP,IOWA CITY,IA 52242

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期

关键词：

ELECTRONICS PACKAGING - Soldering - IMAGE PROCESSING - Image Analysis - SOLDERS - Viscosity;

D O I：

10.1109/TCHMT.1987.1134725

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

An understanding of the behavior and properties of solder paste is essential to comprehend its relationship to the overall manufacturing process using surface mount technology. Techniques to characterize solder paste behavior adequately were explored with particular emphasis on solder particle size and shape and the viscous behavior of the pastes. Size and shape were measured for 24 samples utilizing an image analysis technique which uses Fourier shape descriptors. Viscous behavior was measured over a range of shear rates. The behavior of the paste fits a power law model. The viscous behavior of the pastes was found to be very complex. Metal loading and particle size affected the solder paste. The characterization techniques discussed can be adapted to the specification of solder paste parameters.

引用

页码：224 / 231

页数：8