X-RAY PHOTOELECTRON SPECTROSCOPIC STUDY OF THE CHEMICAL-VAPOR-DEPOSITED W/AL INTERFACE

The dependence of the amount of aluminum trifluoride (AlF3) piled up at the interface of chemical vapor deposited tungsten and the aluminum under layer on the deposition time and subsequent annealing in ultrahigh vacuum (UHV) or in monosilane (SiH4) gas has been studied. AlF3 is formed by the reaction of the aluminum under layer with tungsten hexafluoride (WF6) during the initial state of tungsten chemical vapor deposition. Tungsten was deposited on an Al layer under selective deposition conditions by SiH4 reduction at 250-degrees-C. X-ray photoelectron spectroscopy measurement reveals that the amount of AlF3 decreases with an increase in the tungsten deposition time and that the reduction of AlF3 by volatilization of aluminum fluorides, which occurs at higher temperatures (> 400-degrees-C) is not observed at low temperature (270-degrees-C). Annealing in SiH4 gas after the tungsten deposition was effective to reduce the amount of AlF3 compared with annealing in UHV. This result and thermochemical data would suggest that the dependence of the amount of AlF3 on the tungsten deposition time is explained by the reduction of AlF3 with hydrogen atoms supplied from the dissociation of SiH4.