LIQUID JUNCTIONS FOR CHARACTERIZATION OF ELECTRONIC MATERIALS .5. COMPARISON WITH SOLID-STATE DEVICES USED TO CHARACTERIZE REACTIVE ION ETCHING OF SI

被引:0
作者
FANTINI, MCA [1 ]
SHEN, WM [1 ]
TOMKIEWICZ, M [1 ]
GAMBINO, JP [1 ]
机构
[1] IBM CORP,E FISHKILL FACIL,HOPEWELL JUNCTION,NY 12533
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D O I
10.1063/1.343801
中图分类号
O59 [应用物理学];
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页码:4846 / 4853
页数:8
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