A NEW SET OF PRINTED-CIRCUIT TECHNOLOGIES FOR THE IBM 3081 PROCESSOR UNIT

被引:33
作者
SERAPHIM, DP
机构
关键词
D O I
10.1147/rd.261.0037
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
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页码:37 / 44
页数:8
相关论文
共 10 条
[1]  
Alpaugh W. A., 1978, Insulation/Circuits, V24, P27
[2]  
Blodgett A. J. Jr., 1980, Proceedings of the 30th Electronic Components Conference, P283
[3]   THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE [J].
BLODGETT, AJ ;
BARBOUR, DR .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) :30-36
[4]   A MULTILAYER CERAMIC MULTICHIP MODULE [J].
BLODGETT, AJ .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04) :634-637
[5]  
MOLLEN JC, 1980, P ELECTRONIC COMPONE, P349
[6]  
SERAPHIM DP, 1978, IEEE T COMPON HYBR, V1, P305, DOI 10.1109/TCHMT.1978.1135287
[7]   ELECTRONIC PACKAGING EVOLUTION IN IBM [J].
SERAPHIM, DP ;
FEINBERG, I .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1981, 25 (05) :617-629
[8]  
WERBIZKY GG, 1980, 20TH IEEE COMP C SAN
[9]  
WERBIZKY GG, 1979, ELECTRON, V32, P109
[10]  
WRENNER WR, 1977, CIRCUITS MANUF, V17