共 50 条
[31]
THE SAMARIUM COPPER-ALUMINUM SYSTEM
[J].
DOPOVIDI AKADEMII NAUK UKRAINSKOI RSR SERIYA B-GEOLOGICHNI KHIMICHNI TA BIOLOGICHNI NAUKI,
1983, (08)
:53-55
[33]
Self-aligned passivation technology for copper interconnection using copper-aluminum alloy
[J].
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS,
1997, 36 (3B)
:1548-1553
[35]
Positron annihilation spectroscopy in the evaluation of microstructure of cast copper and copper-aluminum alloys during isochronal annealing
[J].
Journal of Materials Engineering and Performance,
2005, 14
:473-479
[37]
ANNEALING INFLUENCE ON INTERNAL-FRICTION OF DEFORMED COPPER
[J].
FIZIKA METALLOV I METALLOVEDENIE,
1974, 37 (02)
:392-396
[38]
Thermal Stability of Copper-Aluminum Alloy Thin Films
for Barrierless Copper Metallization on Silicon Substrate
[J].
Journal of Electronic Materials,
2017, 46
:4891-4897
[40]
Effect of Annealing on the Mechanical Tensile Behavior of Copper-Aluminum Composites Prepared by Rotary Forging
[J].
RUSSIAN METALLURGY,
2023, 2023 (04)
:508-514