SPUTTERED W-N DIFFUSION-BARRIERS

被引:107
作者
KATTELUS, HP [1 ]
KOLAWA, E [1 ]
AFFOLTER, K [1 ]
NICOLET, MA [1 ]
机构
[1] CALTECH,PASADENA,CA 91125
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 06期
关键词
D O I
10.1116/1.572901
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:2246 / 2254
页数:9
相关论文
共 36 条
[11]   INTERNAL-STRESSES IN SPUTTERED CHROMIUM [J].
HOFFMAN, DW ;
THORNTON, JA .
THIN SOLID FILMS, 1977, 40 (JAN) :355-363
[12]   SUPERCONDUCTING TRANSITION-TEMPERATURES OF REACTIVELY SPUTTERED FILMS OF TANTALUM NITRIDE AND TUNGSTEN NITRIDE [J].
KILBANE, FM ;
HABIG, PS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (01) :107-109
[13]   INFLUENCE OF CU AS AN IMPURITY IN AL/TI AND AL/W THIN-FILM REACTIONS [J].
KRAFCSIK, I ;
GYULAI, J ;
PALMSTROM, CJ ;
MAYER, JW .
APPLIED PHYSICS LETTERS, 1983, 43 (11) :1015-1017
[14]  
MURARKA SP, 1983, SILICIDES VLSI APPLI
[15]   DIFFUSION-BARRIERS IN LAYERED CONTACT STRUCTURES [J].
NICOLET, MA ;
BARTUR, M .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (03) :786-793
[16]   DIFFUSION BARRIERS IN THIN-FILMS [J].
NICOLET, MA .
THIN SOLID FILMS, 1978, 52 (03) :415-443
[17]  
NICOLET MA, 1983, SOLID STATE TECHNOL, V26, P129
[18]   GENERAL-ASPECTS OF BARRIER LAYERS FOR VERY-LARGE-SCALE INTEGRATION APPLICATIONS .2. PRACTICE [J].
NOWICKI, RS ;
NICOLET, MA .
THIN SOLID FILMS, 1982, 96 (04) :317-326
[19]   IMPROVEMENT OF DIFFUSION BARRIER PROPERTIES OF RF-SPUTTERED MOLYBDENUM [J].
NOWICKI, RS ;
WANG, I .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :235-237
[20]   STUDIES OF TI-W-AU METALLIZATION ON ALUMINUM [J].
NOWICKI, RS ;
HARRIS, JM ;
NICOLET, MA ;
MITCHELL, IV .
THIN SOLID FILMS, 1978, 53 (02) :195-205