MULTI-CHIP MODULE TEST AND DIAGNOSTIC METHODOLOGY

被引:7
作者
CURTIN, JJ
WAICUKAUSKI, JA
机构
关键词
D O I
10.1147/rd.271.0027
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
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页码:27 / 34
页数:8
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