DETERMINATION OF GLASS TRANSITION-TEMPERATURE FROM VISCOSITY AND CONDUCTIVITY MEASUREMENTS FOR AN EPOXY-AMINE SYSTEM DURING CURING

被引:24
作者
KOIKE, T
机构
[1] Research and Development Laboratory, Yuka Shell Epoxy Co, Ltd., Yokkaichi-City, Mie, 510
关键词
D O I
10.1002/app.1993.070501111
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The melt viscosity and the direct current (de) conductivity have been investigated for three bisphenol-A novolac-type epoxide oligomers (PGEBANs) that have some branching in each molecule in comparison with the diglycidyl ether of bisphenol-A (DGEBA) oligomer without branching. The novolac-type PGEBAN oligomer has an experimental relationship between the melt viscosity (eta) and the dc conductivity (sigma), sigma.eta(k) = const, which is the same form observed for the DGEBA oligomer. The exponent k has a linear relationship with the glass transition temperature (T-g) for the two types of oligomers with and without branching. The T-g dependence of k for the epoxide oligomers was used to analyze the T-g of a DGEBA-amine system that had some degree of branching in the molecule based on the bisphenol-A structure. The T-g of the DGEBA-amine system, which was calculated from the k that had been nondestructively determined from the viscosity and the conductivity measurements, was consistent with the T-g experimentally measured by differential scanning calorimetry (DSC). (C) 1993 John Wiley & Sons, Inc.
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页码:1943 / 1950
页数:8
相关论文
共 24 条
[1]   ELECTRICAL PROPERTIES OF AN EPOXY RESIN DURING AND AFTER CURING [J].
ADAMEC, V .
JOURNAL OF POLYMER SCIENCE PART A-1-POLYMER CHEMISTRY, 1972, 10 (05) :1277-&
[2]   DIELECTRIC ANALYSIS OF THE CURE OF THERMOSETTING EPOXY AMINE SYSTEMS [J].
BIDSTRUP, SA ;
SHEPPARD, NF ;
SENTURIA, SD .
POLYMER ENGINEERING AND SCIENCE, 1989, 29 (05) :325-328
[3]   MONITORING THE CURE OF A COMPOSITE MATRIX RESIN WITH MICRODIELECTROMETRY [J].
BIDSTRUP, WW ;
SENTURIA, SD .
POLYMER ENGINEERING AND SCIENCE, 1989, 29 (05) :290-294
[4]   MOLECULAR TRANSPORT IN LIQUIDS AND GLASSES [J].
COHEN, MH ;
TURNBULL, D .
JOURNAL OF CHEMICAL PHYSICS, 1959, 31 (05) :1164-1169
[6]  
Delmonte J., 1959, J APPL POLYM SCI, V4, P108, DOI [10.1002/app.1959.070020416, DOI 10.1002/APP.1959.070020416]
[7]  
GOTRO J, 1988, POLYM ENG SCI, V29, P278
[8]   DIELECTRIC-RELAXATION DURING ISOTHERMAL CURING OF EPOXY-RESIN WITH AN AROMATIC AMINE [J].
KOIKE, T .
JOURNAL OF APPLIED POLYMER SCIENCE, 1992, 44 (04) :679-690
[9]   RELATIONSHIP BETWEEN MELT VISCOSITY AND DIELECTRIC-RELAXATION TIME FOR A SERIES OF EPOXIDE OLIGOMERS [J].
KOIKE, T .
JOURNAL OF APPLIED POLYMER SCIENCE, 1993, 47 (03) :387-394
[10]   DIELECTRIC-PROPERTIES ABOVE THE GLASS-TRANSITION FOR A SERIES OF EPOXIDE PREPOLYMERS [J].
KOIKE, T ;
TANAKA, R .
JOURNAL OF APPLIED POLYMER SCIENCE, 1991, 42 (05) :1333-1340