Analysis of a novel elevated coplanar waveguide with finite metallization thickness

被引：0

作者：

Raju, S ^{[1
]}

Abhaikumar, V ^{[1
]}

Nityanandan, BN ^{[1
]}

机构：

[1] AK COLL ENGN, KRISHNAN KOIL, TAMIL NADU, INDIA

来源：

JOURNAL OF THE INSTITUTION OF ELECTRONICS AND TELECOMMUNICATION ENGINEERS | 1995年 / 41卷 / 02期

关键词：

microwave integrated circuits; coplanar waveguide; finite element method;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper a novel elevated coplanar waveguide is proposed and its line parameters have been calculated using a modified universal matrices finite element method with a view to highlight the possibility of miniaturised microwave structures, Further, the effects of dielectric layer, substrate, shielding and the finite metallization thickness on the line parameters of the proposed structures have also been presented.

引用

页码：143 / 149

页数：7

共 16 条

[1]

ABHAIKUMAR V, 1989, INT J ELECTRON, V66, P139

[2]

Bhat Bharathi, 1989, STRIPLINE LIKE TRANS

[3] COPLANAR WAVE-GUIDES FOR MMIC APPLICATIONS - EFFECT OF UPPER SHIELDING, CONDUCTOR BACKING, FINITE-EXTENT GROUND PLANES, AND LINE-TO-LINE COUPLING [J].