KINETIC-STUDY OF THE REACTION BETWEEN COPPER(I) CHLORIDE AND COMMERCIAL SILICON OR SILICIDES

被引：10
作者：
GILLOT, B
SOUHA, H
VIALE, D
机构：
[1] Faculté des Sciences Mirande, Laboratoire de Recherches sur la Réactivité des Solides UA 23, Dijon Cedex, 21004
来源：
JOURNAL OF MATERIALS SCIENCE | 1992年 / 27卷 / 05期
关键词：
D O I：
10.1007/BF01142049
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The reaction of CuCl with silicon containing as impurities Al, Fe, Ca and Ti or with some silicides (Si2Ca, Si2Fe, Si2Ti) has been investigated in the temperature range 250-310-degrees-C. For the reaction between CuCl and commercial Si, it has been found that at 282-degrees-C, the aluminium promotes the reaction between Cu3Si and CuCl while its rate of consumption is greatly decreased by the presence of iron impurity. The combined action of these two impurities improves the quantity of the copper-silicon alloy formed. In the presence of silicides, the reaction with CuCl leads to copper formation with a high degree of dispersion.
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页码：1337 / 1342
页数：6
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