SUB-BAND-GAP LASER MICROMACHINING OF LITHIUM-NIOBATE

被引:33
作者
CHRISTENSEN, FK [1 ]
MULLENBORN, M [1 ]
机构
[1] TECH UNIV DENMARK,CTR MIKROELEKTRON,DK-2800 LYNGBY,DENMARK
关键词
D O I
10.1063/1.113470
中图分类号
O59 [应用物理学];
学科分类号
摘要
Laser processing of insulators and semiconductors is usually realized using photon energies exceeding the band-gap energy. This makes laser processing of insulators difficult since high photon energies typically require either a pulsed laser or a frequency-doubled continuous-wave laser. A new method is reported which enables us to do laser processing of lithium niobate using sub-band-gap photons. Using high scan speeds, moderate power densities, and sub-band-gap photon energies results in volume removal rates in excess of 106μm3/s. This enables fast micromachining of small piezoelectric structures, or simple etching of grooves for precision positioning of optical fibers.© 1995 American Institute of Physics.
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页码:2772 / 2773
页数:2
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