MICROMACHINING FOR IMPROVEMENT OF INTEGRATED ULTRASONIC TRANSDUCER SENSITIVITY

被引：40

作者：

MO, JH ^{[1
]}

ROBINSON, AL ^{[1
]}

FITTING, DW ^{[1
]}

TERRY, FL ^{[1
]}

CARSON, PL ^{[1
]}

机构：

[1] UNIV MICHIGAN,MED CTR,DEPT RADIOL,DIV RADIOL PHYS & ENGN,ANN ARBOR,MI 48104

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1990年 / 37卷 / 01期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1109/16.43810

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present a micromachined diaphragm structure for integrated ultrasonic transducers. The micromachining significantly reduces a large parasitic capacitance, resulting in improved sensitivity compared with identical transducers on solid substrates. For the particular geometry tested, sensitivity is improved 8.9 dB; this result matches a prediction of 10.9 dB, based on a simple model, reasonably well. This level of improvement is considered significant for applications under consideration (medical imaging and nondestructive evaluation). © 1990 IEEE

引用

页码：134 / 140

页数：7

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