COMPARISON OF MICROWAVE AND LOWER FREQUENCY PLASMAS FOR THIN-FILM DEPOSITION AND ETCHING

被引：101
作者：
WERTHEIMER, MR
MOISAN, M
机构：
[1] ECOLE POLYTECH, DEPT ENGN PHYS, MONTREAL H3C 3A7, QUEBEC, CANADA
[2] UNIV MONTREAL, DEPT PHYS, MONTREAL H3C 3J7, QUEBEC, CANADA
来源：
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 1985年 / 3卷 / 06期
关键词：
D O I：
10.1116/1.572805
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：2643 / 2649
页数：7
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