Determination of channel temperature for AlGaN/GaN HEMTs by high spectral resolution micro-Raman spectroscopy

被引:5
作者
Zhang Guangchen [1 ]
Feng Shiwei [1 ]
Li Jingwan [1 ]
Zhao Yan [2 ]
Guo Chunsheng [1 ]
机构
[1] Beijing Univ Technol, Sch Elect Informat & Control Engn, Beijing 100124, Peoples R China
[2] Beijing Univ Technol, Inst Laser Engn, Beijing 100124, Peoples R China
关键词
HEMT; channel temperature; micro-Raman spectroscopy;
D O I
10.1088/1674-4926/33/4/044003
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
Channel temperature determinations of AlGaN/GaN high electron mobility transistors (HEMTs) by high spectral resolution micro-Raman spectroscopy are proposed. The temperature dependence of the E2 phonon frequency of GaN material is calibrated by using a JYT-64000 micro-Raman system. By using the Lorentz fitting method, the measurement uncertainty for the Raman phonon frequency of +/- 0.035 cm(-1) is achieved, corresponding to a temperature accuracy of +/- 3.2 degrees C for GaN material, which is the highest temperature resolution in the published works. The thermal resistance of the tested AlGaN/GaN HEMT sample is 22.8 degrees C/W, which is in reasonably good agreement with a three dimensional heat conduction simulation. The difference among the channel temperatures obtained by micro-Raman spectroscopy, the pulsed electrical method and the infrared image method are also investigated quantificationally.
引用
收藏
页数:5
相关论文
共 22 条
  • [1] ANSYS Inc, 2006, ANSYS REL 11 0 DOC
  • [2] Aubry R, 2005, EUR PHYS J-APPL PHYS, V30, P77, DOI [10.1051/epjap:2005025, 10.1015/epjap:2005025]
  • [3] Temperature measurement by micro-Raman scattering spectroscopy in the active zone of AlGaN/GaN high-electron-mobility transistors
    Aubry, R
    Dua, C
    Jacquet, JC
    Lemaire, F
    Galtier, P
    Dessertenne, B
    Cordier, Y
    DiForte-Poisson, MA
    Delage, SL
    [J]. EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 2004, 27 (1-3) : 293 - 296
  • [4] Three-dimensional finite-element thermal simulation of GaN-based HEMTs
    Bertoluzza, F.
    Delmonte, N.
    Menozzi, R.
    [J]. MICROELECTRONICS RELIABILITY, 2009, 49 (05) : 468 - 473
  • [5] Temperature measurements of semiconductor devices - A review
    Blackburn, DL
    [J]. TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004, 2004, : 70 - 80
  • [6] A thermal model for static current characteristics of AlGaN/GaN high electron mobility transistors including self-heating effect - art. no. 044501
    Chang, YC
    Zhang, YM
    Zhang, YM
    Tong, KY
    [J]. JOURNAL OF APPLIED PHYSICS, 2006, 99 (04)
  • [7] High-current-density high-voltage normally-off AlGaN/GaN hybrid-gate HEMT with low on-resistance
    Chen, W.
    Zhou, C.
    Chen, K. J.
    [J]. ELECTRONICS LETTERS, 2010, 46 (24) : 1626 - 1627
  • [8] Noncontact temperature measurements of diamond by Raman scattering spectroscopy
    Cui, JB
    Amtmann, K
    Ristein, J
    Ley, L
    [J]. JOURNAL OF APPLIED PHYSICS, 1998, 83 (12) : 7929 - 7933
  • [9] GaN HEMT reliability
    del Alamo, J. A.
    Joh, J.
    [J]. MICROELECTRONICS RELIABILITY, 2009, 49 (9-11) : 1200 - 1206
  • [10] Determination of Channel Temperature of AlGaN/GaN HEMT by Electrical Method
    Feng, Shiwei
    Hu, Peifeng
    Zhang, Guangchen
    Guo, Chunsheng
    Xie, Xuesong
    Chen, Tangsheng
    [J]. 26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2010, 2010, : 165 - 169