STRUCTURE INVESTIGATIONS OF PURE AND PARTIALLY OXIDIZED COPPER-FILMS

Copper films in the thickness range 25 - 150 nm are deposited on glass substrates under ultrahigh-vacuum conditions. After an annealing treatment at 150-degrees-C, the structure of the pure as well as of the partially oxidized films is investigated by means of X-ray diffraction analysis. Additional information is provided by scanning electron microscopy and resistivity measurements. The pure films have a polycrystalline structure with a marked (111) fiber texture. The crystallite shapes are plate-like with a plate thickness approximately corresponding to film thickness for thinner films, and cube-like for thicker films. A Cu2O phase is detected after interaction with oxygen at pressures of 25 mbar and temperatures of 150-degrees-C.