共 10 条
[1]
Berriche R., 1987, Electronic Packaging and Corrosion in Microelectronics. Proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes and Corrosion in Microelectronics, P169
[2]
SOLDER FATIGUE PROBLEMS IN POWER PACKAGES
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1984, 7 (04)
:405-410
[3]
Coffin L., 1973, FATIGUE ELEVATED TEM, V520, P5
[4]
ECKEL JF, 1951, P ASTM, V51, P721
[5]
LAU JH, 1985, SOLID STATE TECHNOL, V28, P91
[6]
PETERS D, 1987, COMMUNICATION
[7]
EFFECT OF CYCLE FREQUENCY + ATMOSPHERIC CORROSION ON FATIGUE OF LEAD
[J].
PHILOSOPHICAL MAGAZINE,
1964, 10 (105)
:435-&
[9]
Solomon H. D., 1986, BRAZING SOLDERING, V11, P68
[10]
Woodford DA, 1983, TREATISE MAT SCI TEC, V25, P157