DIFFUSION MODELING OF ION-IMPLANTED BORON IN SI DURING RTA - CORRELATION OF EXTENDED DEFECT FORMATION AND ANNEALING WITH THE ENHANCED DIFFUSION OF BORON

被引:13
作者
KINOSHITA, H [1 ]
LO, GQ [1 ]
KWONG, DL [1 ]
NOVAK, S [1 ]
机构
[1] EVANS E INC,PLAINSBORO,NJ 08536
关键词
D O I
10.1149/1.2056097
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Accurate modeling of the enhanced diffusion of boron during rapid thermal annealing has been accomplished by incorporating the effects of extended defect formation and annealing on enhanced diffusion into a multizone, semiempirical model. The multizone model divides the implant profile into three zones defining regions of different defects and diffusion enhancements. The model also contains the initial enhanced diffusion and the transient diffusion effects associated with the dissolution of defect clusters and the annealing of extended defects, respectively. The saturation time for transient-enhanced diffusion contains an exponential function of implant dose in order to model the increase in point defect generated with higher implant dose. As a result, the model accurately simulates the boron diffusion profile over a wide range of implant doses and also shows the immobile boron peak of precipitated dopants produced during high dose implantation.
引用
收藏
页码:248 / 252
页数:5
相关论文
共 15 条
[1]   COMPARISON OF BORON DIFFUSIVITY DURING RAPID THERMAL ANNEALING IN PREDAMAGED, PREAMORPHIZED AND CRYSTALLINE SILICON [J].
ARMIGLIATO, A ;
GUIMARAES, S ;
SOLMI, S ;
KOGLER, R ;
WIESER, E .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1987, 19-20 :512-515
[2]   ROLE OF POINT-DEFECTS IN THE TRANSIENT DIFFUSION AND CLUSTERING OF IMPLANTED BORON IN SILICON [J].
COWERN, NEB ;
JOS, HFF ;
JANSSEN, KTF .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1989, 4 (1-4) :101-105
[3]   POINT-DEFECT CHARGE-STATE EFFECTS ON TRANSIENT DIFFUSION OF DOPANTS IN SI [J].
FAIR, RB .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (02) :667-671
[4]  
FAIR RB, 1984, J ELECTROCHEM SOC, V131, P2385
[5]   MEASUREMENT OF SILICON INTERSTITIAL DIFFUSIVITY [J].
GRIFFIN, PB ;
FAHEY, PM ;
PLUMMER, JD ;
DUTTON, RW .
APPLIED PHYSICS LETTERS, 1985, 47 (03) :319-321
[6]   VLSI PROCESS MODELING - SUPREM-III [J].
HO, CP ;
PLUMMER, JD ;
HANSEN, SE ;
DUTTON, RW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (11) :1438-1453
[7]   EXTENDED DEFECT EVOLUTION IN BORON-IMPLANTED SI DURING RAPID THERMAL ANNEALING AND ITS EFFECTS ON THE ANOMALOUS BORON-DIFFUSION [J].
KIM, YM ;
LO, GQ ;
KWONG, DL ;
TASCH, AF ;
NOVAK, S .
APPLIED PHYSICS LETTERS, 1990, 56 (13) :1254-1256
[8]  
Klein K. M., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P745, DOI 10.1109/IEDM.1990.237093
[9]   MULTIZONE MODELING OF IMPURITY REDISTRIBUTION IN ION-IMPLANTED MATERIALS [J].
KWOR, R ;
DEARAUJO, CP .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (07) :1580-1586
[10]  
MADER S, 1984, ION IMPANTATION SCI