BUBBLE-FREE SILICON-WAFER BONDING IN A NON-CLEANROOM ENVIRONMENT

被引：96

作者：

STENGL, R ^{[1
]}

AHN, KY ^{[1
]}

GOSELE, U ^{[1
]}

机构：

[1] DUKE UNIV, SCH ENGN, DEPT MECH ENGN & MAT SCI, DURHAM, NC 27706 USA

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS | 1988年 / 27卷 / 12期

关键词：

D O I：

10.1143/JJAP.27.L2364

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：L2364 / L2366

页数：3

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