PHENOMENOLOGICAL DESCRIPTION OF THIN-FILM INTER-DIFFUSION

被引:0
作者
NAKAHARA, S
机构
来源
PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS | 1982年 / 346卷
关键词
D O I
暂无
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
引用
收藏
页码:39 / 46
页数:8
相关论文
共 33 条
[1]  
BALLIFFI RW, 1975, THIN SOLID FILMS, V25, P339
[2]   MECHANISM OF PORE FORMATION ASSOCIATED WITH THE KIRKENDALL EFFECT [J].
BRINKMAN, JA .
ACTA METALLURGICA, 1955, 3 (02) :140-145
[3]   A STUDY OF EVAPORATED GOLD-TIN FILMS USING TRANSMISSION ELECTRON-MICROSCOPY .2. [J].
BUENE, L ;
FALKENBERGARELL, H ;
GJONNES, J ;
TAFTO, J .
THIN SOLID FILMS, 1980, 67 (01) :95-102
[4]   DIFFUSION INDUCED GRAIN-BOUNDARY MIGRATION [J].
CAHN, JW ;
PAN, JD ;
BALLUFFI, RW .
SCRIPTA METALLURGICA, 1979, 13 (06) :503-509
[5]  
CAMPISANO SU, 1978, P S THIN FILM PHENOM, V78, P129
[6]  
Den Broeder F.J.A., 1972, ACTA METALL, V20, P319, DOI [10.1016/0001-6160(72)90024-7, DOI 10.1016/0001-6160(72)90024-7]
[7]  
DENBROEDER FJA, UNPUB
[8]  
GARBOVITSKAYA TG, FIZ METAL METALLOVED
[9]  
Hansen M., 1958, J ELECTROCHEM SOC, DOI DOI 10.1149/1.2428700
[10]   ADHESION MECHANISM OF GOLD-UNDERLAYER FILM COMBINATIONS TO OXIDE SUBSTRATES [J].
HAQ, KE ;
BEHRNDT, KH ;
KOBIN, I .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (01) :148-&