A COMPARISON OF TUNGSTEN FILM DEPOSITION TECHNIQUES FOR VERY LARGE-SCALE INTEGRATION TECHNOLOGY

被引：34
作者：
AHN, KY
机构：
来源：
THIN SOLID FILMS | 1987年 / 153卷
关键词：
D O I：
10.1016/0040-6090(87)90206-9
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
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页码：469 / 478
页数：10
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