CHARACTERIZATION OF TERNARY CU-SN-AU BULK ALLOYS AND THIN-FILMS

被引：2

作者：

KIM, J

机构：

来源：

关键词：

D O I：

10.1007/BF02659843

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：191 / 209

页数：19

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