SUPPRESSION OF PLATINUM PENETRATION FAILURE IN TI/PT/AU BEAM LEAD METAL SYSTEMS USING A TIN DIFFUSION BARRIER

被引:13
作者
KANAMORI, S
MATZUMOTO, T
机构
关键词
D O I
10.1016/0040-6090(83)90238-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:205 / 213
页数:9
相关论文
共 20 条
[1]   THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS [J].
CHEUNG, NW ;
VONSEEFELD, H ;
NICOLET, MA ;
HO, F ;
ILES, P .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) :4297-4299
[2]  
CHEUNG NW, 1980, P S THIN FILM INTERF, V80, P323
[3]  
FOURNIER PR, 1975, Patent No. 3879746
[4]   TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM [J].
GARCEAU, WJ ;
FOURNIER, PR ;
HERB, GK .
THIN SOLID FILMS, 1979, 60 (02) :237-247
[5]  
Hansen M., 1958, J ELECTROCHEM SOC, DOI DOI 10.1149/1.2428700
[6]   ELECTRONIC STATES OF NI-SILICIDES AND ITS RELATION TO METAL-SILICIDE-SI INTERFACES [J].
IWAMI, M ;
OKUNO, K ;
KAMEI, S ;
ITO, T ;
HIRAKI, A .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (07) :1542-1545
[7]   EFFECTS OF TITANIUM LAYER AS DIFFUSION BARRIER IN TI/PT/AU BEAM LEAD METALLIZATION ON POLYSILICON [J].
KANAMORI, S ;
SUDO, H .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (03) :318-321
[8]   LOCALIZED PLATINUM SILICIDE GROWTH CAUSING TI/PT/AU BEAM LEAD METALLIZATION INSTABILITY [J].
KANAMORI, S .
THIN SOLID FILMS, 1982, 92 (1-2) :L67-L68
[10]   BEAM-LEAD TECHNOLOGY [J].
LEPSELTE.MP .
BELL SYSTEM TECHNICAL JOURNAL, 1966, 45 (02) :233-&