A NOVEL FLIP-CHIP INTERCONNECTION TECHNIQUE USING SOLDER BUMPS FOR HIGH-SPEED PHOTORECEIVERS

A flip-chip interconnection technique using small solder bumps instead of conventional wire bonding for high-speed broad-band photoreceivers is described. The technique achieves interconnection with low parasitic elements, no damage to devices, and easy assembly. A photoreceiver composed of a broad-band positive-intrinsic-negative (p-i-n) photodiode and a high-speed GaAs metal-semiconductor field-effect transistor (MESFET) preamplifier connected using solder bumps that are about 26 µm in diameter, with a frequency response of over 22 GHz at 1.55 µm, has been demonstrated. This confirms the effectiveness of the solder bump interconnection technique for future high-speed broad-band optical modules. © 1990 IEEE