Constructal re-optimization of heat conduction with the triangular elemental area

A re-analysis of the 'tree-shaped network' constructal method for triangular-shaped electronics is presented. The high effective conduction channel distribution has been re-optimized by using a triangular elemental area, without the premise that the new-order assembly construct must be assembled by the optimized last-order construct. A more optimal construct with triangular elemental area is obtained, and when the thermal conductivity and the proportion of the two heat conduction materials are constants, the limit of the minimum heat resistance with the triangular elemental area is derived. All these conclusions can be used as a guide for engineering applications.