Mechanism of the self-changing parameters and characteristics in AlGaN/GaN high-electron mobility transistors after a step voltage stress

被引:2
作者
Shi Lei [1 ]
Feng Shiwei [1 ]
Liu Kun [1 ]
Zhang Yamin [1 ]
机构
[1] Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China
基金
中国国家自然科学基金; 北京市自然科学基金;
关键词
AlGaN/GaN HEMTs; surface states; self-changing; stress;
D O I
10.1088/1674-4926/36/7/074005
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
The phenomenon of self-changing on the device parameters and characteristics after a step voltage stress was applied to the gate is studied in AlGaN/GaN high electron mobility transistors. The device was measured every 5 min after the stress was removed. The large-signal parasitic source (drain) resistance, transfer characteristics, threshold voltage, drain-source current, gate-source (drain) reverse current-voltage characteristics changed spontaneously after the removal of the stress. The time constant of the self-changing was about 25-27 min. The gate-source (drain) capacitance-voltage characteristics were constant during this process. Electrons were trapped by the surface states and traps in the AlGaN barrier layer when the device was under stress. The traps in the AlGaN barrier layer then released electrons in less than 10 s. The surface states released electrons continuously during the entire measurement stage, leading to the self-changing of mearsurement result.
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页数:5
相关论文
共 16 条
  • [1] Fluorine-plasma surface treatment for gate forward leakage current reduction in AlGaN/GaN HEMTs
    Chen Wanjun
    Zhang Jing
    Zhang Bo
    Chen Kevin Jing
    [J]. JOURNAL OF SEMICONDUCTORS, 2013, 34 (02)
  • [2] Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems
    Dammann, M.
    Pletschen, W.
    Waltereit, P.
    Bronner, W.
    Quay, R.
    Mueller, S.
    Mikulla, M.
    Ambacher, O.
    van der Wel, P. J.
    Murad, S.
    Rodle, T.
    Behtash, R.
    Bourgeois, F.
    Riepe, K.
    Fagerlind, M.
    Sveinbjornsson, E. O.
    [J]. MICROELECTRONICS RELIABILITY, 2009, 49 (05) : 474 - 477
  • [3] Nonlinear source and drain resistance in recessed-gate heterostructure field-effect transistors
    Greenberg, DR
    delAlamo, JA
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1996, 43 (08) : 1304 - 1306
  • [4] IMPACT IONIZATION AND TRANSPORT IN THE INALAS/N(+)-INP HFET
    GREENBERG, DR
    DELALAMO, JA
    BHAT, R
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1995, 42 (09) : 1574 - 1582
  • [5] Low ohmic contact AlN/GaN HEMTs grown by MOCVD
    Gu Guodong
    Dun Shaobo
    Lu Yuanjie
    Han Tingting
    Xu Peng
    Yin Jiayun
    Feng Zhihong
    [J]. JOURNAL OF SEMICONDUCTORS, 2013, 34 (11)
  • [6] Joh J., 2006, INT EL DEVICES MEET, P1, DOI [10.1109/IEDM.2006.346799, DOI 10.1109/IEDM.2006.346799]
  • [7] Critical voltage for electrical degradation of GaN high-electron mobility transistors
    Joh, Jungwoo
    del Alamo, Jesus A.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2008, 29 (04) : 287 - 289
  • [8] A Current-Transient Methodology for Trap Analysis for GaN High Electron Mobility Transistors
    Joh, Jungwoo
    del Alamo, Jesus A.
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2011, 58 (01) : 132 - 140
  • [9] Khandelwal Sourabh, 2012, 2012 8 INT CAR C DEV, DOI [10.1109/ ICCDCS.2012.6188891, DOI 10.1109/ICCDCS.2012.6188891]
  • [10] Slow transients observed in AlGaN/GaN HFETs:: Effects of SiNx passivation and UV illumination
    Koley, G
    Tilak, V
    Eastman, LF
    Spencer, MG
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (04) : 886 - 893