SINTERING OF OXIDE-DISPERSED COPPER-POWDER COMPACTS

被引：0
|
作者：
PERRY, E [1 ]
JOHNSON, DL [1 ]
机构：
[1] NORTHWESTERN UNIV,EVANSTON,IL 60201
来源：
AMERICAN CERAMIC SOCIETY BULLETIN | 1982年 / 61卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：811 / 811
页数：1
相关论文
共 50 条
  • [21] ELECTRICAL-CONDUCTIVITY OF COPPER-POWDER AS DEPENDENT ON PRESSING PRESSURE AND SINTERING TEMPERATURE
    PISZCZEK, T
    STOLARZ, S
    POWDER METALLURGY INTERNATIONAL, 1986, 18 (01): : 9 - 11
  • [22] FINELY DIVIDED COPPER-POWDER
    KOMAROV, VP
    LAZAREV, VB
    SHAPLYGIN, IS
    INORGANIC MATERIALS, 1984, 20 (05) : 669 - 671
  • [23] DYNAMIC CONSOLIDATION OF COPPER-POWDER
    THOMAS, T
    BENSUSSAN, P
    CHARTAGNAC, P
    JOURNAL DE PHYSIQUE III, 1991, 1 (C3): : 131 - 138
  • [24] COPPER-POWDER METALLURGY FOR BEARINGS
    MORGAN, VT
    INTERNATIONAL JOURNAL OF POWDER METALLURGY, 1979, 15 (04): : 279 - &
  • [25] Deposition and Oxidation of Oxide-Dispersed CoNiCrAlY Bondcoats
    Okada, Mitsutoshi
    Vassen, Robert
    Karger, Matthias
    Sebold, Doris
    Mack, Daniel
    Jarligo, Maria Ophelia
    Bozza, Francesco
    JOURNAL OF THERMAL SPRAY TECHNOLOGY, 2014, 23 (1-2) : 147 - 153
  • [26] Nano oxide-dispersed nickel composite plating
    So-Yeon Park
    Myung-Won Jung
    Jae-Ho Lee
    Electronic Materials Letters, 2013, 9 : 801 - 804
  • [27] EFFECTS OF THE LOADINGS AND TYPE OF COPPER-POWDER ON THE ELECTRICAL-RESISTIVITY OF COPPER-POWDER POLYMER PAINT FILMS
    MORI, K
    OKAI, Y
    YAMADA, H
    KASHIWABA, Y
    JOURNAL OF MATERIALS SCIENCE, 1993, 28 (02) : 367 - 372
  • [28] Nano oxide-dispersed nickel composite plating
    Park, So-Yeon
    Jung, Myung-Won
    Lee, Jae-Ho
    ELECTRONIC MATERIALS LETTERS, 2013, 9 (06) : 801 - 804
  • [29] Deposition and Oxidation of Oxide-Dispersed CoNiCrAlY Bondcoats
    Mitsutoshi Okada
    Robert Vassen
    Matthias Karger
    Doris Sebold
    Daniel Mack
    Maria Ophelia Jarligo
    Francesco Bozza
    Journal of Thermal Spray Technology, 2014, 23 : 147 - 153
  • [30] CEMENTATION OF COPPER-POWDER ON ALUMINUM SHEET
    BHATGADDE, LG
    RESEARCH AND INDUSTRY, 1980, 25 (02): : 71 - 73
12345